來源：學(xué)術(shù)之家整理 2025-03-18 15:36:27
《Ieee Transactions On Dielectrics And Electrical Insulation》中文名稱：《IEEE Transactions On Dielectrics and Electrical Insulations》，創(chuàng)刊于1994年，由Institute of Electrical and Electronics Engineers Inc.出版商出版，出版周期Bimonthly。
與介電現(xiàn)象和測量有關(guān)的主題，與氣體、真空、液體和固體電絕緣材料和系統(tǒng)的開發(fā)和特性有關(guān)的主題；以及與在使用條件下在電路和系統(tǒng)中使用這些材料有關(guān)的主題。
旨在及時、準(zhǔn)確、全面地報(bào)道國內(nèi)外ENGINEERING, ELECTRICAL & ELECTRONIC工作者在該領(lǐng)域的科學(xué)研究等工作中取得的經(jīng)驗(yàn)、科研成果、技術(shù)革新、學(xué)術(shù)動態(tài)等。
| 機(jī)構(gòu)名稱 | 發(fā)文量 |
| XI'AN JIAOTONG UNIVERSI... | 120 |
| CHONGQING UNIVERSITY | 56 |
| TSINGHUA UNIVERSITY | 54 |
| STATE GRID CORPORATION ... | 48 |
| TIANJIN UNIVERSITY | 43 |
| CENTRE NATIONAL DE LA R... | 38 |
| NORTH CHINA ELECTRIC PO... | 34 |
| CHINA SOUTHERN POWER GR... | 30 |
| UNIVERSITY OF SOUTHAMPT... | 26 |
| INDIAN INSTITUTE OF TEC... | 24 |
| 國家/地區(qū) | 發(fā)文量 |
| CHINA MAINLAND | 433 |
| Japan | 62 |
| England | 57 |
| USA | 57 |
| France | 51 |
| India | 50 |
| GERMANY (FED REP GER) | 36 |
| Italy | 31 |
| Canada | 25 |
| Algeria | 21 |
| 文章引用名稱 | 引用次數(shù) |
| Understanding Surface Charge... | 28 |
| Numerical Modeling of Partia... | 24 |
| Novel HVDC Spacers by Adapti... | 23 |
| Surface Functional Graded Sp... | 18 |
| Novel HVDC Spacers by Adapti... | 16 |
| Temperature Dependent Surfac... | 16 |
| Insulation Condition Diagnos... | 15 |
| Surface Charge Accumulation ... | 15 |
| Fluoronitrile/CO2 Mixture as... | 15 |
| Correlation between Surface ... | 14 |
| 被引用期刊名稱 | 數(shù)量 |
| IEEE T DIELECT EL IN | 1500 |
| IEEE ACCESS | 842 |
| IET SCI MEAS TECHNOL | 525 |
| ENERGIES | 522 |
| POLYMERS-BASEL | 306 |
| HIGH VOLT | 285 |
| IEEE T PLASMA SCI | 268 |
| IEEE T POWER DELIVER | 257 |
| MATER RES EXPRESS | 190 |
| SENSORS-BASEL | 190 |
| 引用期刊名稱 | 數(shù)量 |
| IEEE T DIELECT EL IN | 1500 |
| IEEE ELECTR INSUL M | 188 |
| J PHYS D APPL PHYS | 173 |
| J APPL PHYS | 160 |
| IEEE T POWER DELIVER | 123 |
| IEEE T PLASMA SCI | 115 |
| APPL PHYS LETT | 70 |
| IET SCI MEAS TECHNOL | 27 |
| J CHEM PHYS | 26 |
| IEEE T IND APPL | 24 |
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